Extract RLCG parameters from an interconnect structure. Perform 3D and 2D field simulations of electromagnetic fields with a quasi-static charge. Access the target structures and manage their interconnected elements, automatically generate SPICE subcircuit models.
ANSYS Q3D Extractor efficiently performs the 3-D and 2-D quasi-static electromagnetic field simulations required for the extraction of RLCG parameters from an interconnect structure. It then automatically generates an equivalent SPICE subcircuit model. These highly accurate models can be used to perform signal integrity analysis to study electromagnetic phenomena, such as crosstalk, ground bounce, interconnect delays and ringing, to understand the performance of interconnects, IC packages, connectors, PCB’s, bus bars and cables.
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